We supply a wide range of thick / thin film qomposites / qoatings / qompaunds for various surface types used in aerospace, automative, semiconductor, dielectric, electronics, component manufacturing, telecommunication and consumer markets. Our electrically conductive (EC) products range may be transparent, translucent and also opaque (as well as in different colours) in the form of fluid (liquid / paste).
We supply a wide range of thick / thin film qomposites / qoatings / qompaunds for various surface types used in aerospace, automative, semiconductor, dielectric, electronics, component manufacturing, telecommunication and consumer markets. Our electrically conductive (EC) products range may be transparent, translucent and also opaque (as well as in different colours) in the form of fluid (liquid / paste).
EC+Ag is silver-ly screen printable / slot-coatable / brush applicable silver qomposite. There are various types of conductive silver qomposites; the transparent (EC+Ag TRANSPARENT) and general purpose (EC+Ag GENERAL) electro-cunductive silver qompaunds are two of them. EC+Ag INK is a room temperature curable conductive ink.
EC+Pt is a screen-printable / brush applicable platinum conductor paste used for ceramic surfaces (sensors), dye solar cells and high temperature dielectrics. EC+Pt provides thermal and chemical stability for long-term performance.
Solid content: 75-80 %.
Our EC+Rh qomposite has a unique formulation which is adjustable according to customer need. It has high wear resistance and strong chemical stability for specialised electronic components.
Our EC+Rh qomposite has a unique formulation which is adjustable according to customer need. It has high wear resistance and strong chemical stability for specialised electronic components.
We also supply a wide range of inorganic and organic transparent, translucent and also opaque (as well as in different colours) in the form of fluid (liquid / paste) electrical conductive (EC) adducts (coating materials / adhesives) used in Printed Circuit Boards (PCBs), Chip Bonding, Solar Cells, Touchscreens and Displays, Electromagnetic Shielding and similar applications.